A reflow oven is used to attach electrical components to a printed circuit board, PCB. This is achieved with the use of solder paste. The process is a delicate balance of heating the solder paste just enough to attach the component or components, but the initial heat cannot be so high that is damages the components or the circuit board. The ovens are now available in the desktop reflow oven model. The prices range from around four to six thousand dollars.
The technology used for the soldering ovens is called SMT, surface mount technology. Another term used for the ovens is P&P or pick and place machines. Floor models of soldering ovens take up a significant amount of floor space. They are also roughly ten times as costly as the desktop versions of reflow ovens.
The soldering process is highly sophisticated and must be managed with precision. Computerized electronic systems are in many of the products people use every day. Computers, calculators and cars are only a few. Robotic surface mount technology, SMT, is used in manufacturing many of these products.
There are four stages to the reflow process. First is the preheat zone, next the thermal soak, then the reflow zone and last the cooling zone. Each zone accomplishes a different purpose. The preheat stage must be sensitive to the maximum slope, the rate at which the heat increases. If heat increase too quickly or too slowly the components could be damaged or the flux will not evaporate sufficiently.
Next is the thermal soak zone. This stage is brief lasting less than two minutes. This stage is to activate the flux, the chemical cleaning agent found in the solder paste. Precision is still of ultimate importance. When the heat is too low the flux will not activate sufficiently. When it is too high the solder can spatter or the paste may become damaged. At the close of the thermal soak that thermal equilibrium be achieved.
The third stage, the reflow zone, is when the maximum temperature is reached. The rule is that the peak temperature must be 5 degrees C below the component with the lowest tolerance for heat. During this phase the solder paste is liquid and reflows through the assembly to accomplish metallurgical bonding, the point of the entire process. At this stage precision is required both in terms of temperature and time.
During the fourth and last stage, the cooling zone, the entire assembly will cool and solder joints will become solid. In the previous stage the assembly was at its maximum heat. During this stage it will cool at the rate of about 4 degrees C per second. The PCB and the bonded components are now ready for the next stage of assembly in the manufacturing process.
Take the time to research the various manufacturers of soldering ovens before making a purchase. Check with professionals knowledgeable in this area to get some brand recommendations. People who have used the machines can give you the best advice, if this is your first purchase of a reflow oven.
The technology used for the soldering ovens is called SMT, surface mount technology. Another term used for the ovens is P&P or pick and place machines. Floor models of soldering ovens take up a significant amount of floor space. They are also roughly ten times as costly as the desktop versions of reflow ovens.
The soldering process is highly sophisticated and must be managed with precision. Computerized electronic systems are in many of the products people use every day. Computers, calculators and cars are only a few. Robotic surface mount technology, SMT, is used in manufacturing many of these products.
There are four stages to the reflow process. First is the preheat zone, next the thermal soak, then the reflow zone and last the cooling zone. Each zone accomplishes a different purpose. The preheat stage must be sensitive to the maximum slope, the rate at which the heat increases. If heat increase too quickly or too slowly the components could be damaged or the flux will not evaporate sufficiently.
Next is the thermal soak zone. This stage is brief lasting less than two minutes. This stage is to activate the flux, the chemical cleaning agent found in the solder paste. Precision is still of ultimate importance. When the heat is too low the flux will not activate sufficiently. When it is too high the solder can spatter or the paste may become damaged. At the close of the thermal soak that thermal equilibrium be achieved.
The third stage, the reflow zone, is when the maximum temperature is reached. The rule is that the peak temperature must be 5 degrees C below the component with the lowest tolerance for heat. During this phase the solder paste is liquid and reflows through the assembly to accomplish metallurgical bonding, the point of the entire process. At this stage precision is required both in terms of temperature and time.
During the fourth and last stage, the cooling zone, the entire assembly will cool and solder joints will become solid. In the previous stage the assembly was at its maximum heat. During this stage it will cool at the rate of about 4 degrees C per second. The PCB and the bonded components are now ready for the next stage of assembly in the manufacturing process.
Take the time to research the various manufacturers of soldering ovens before making a purchase. Check with professionals knowledgeable in this area to get some brand recommendations. People who have used the machines can give you the best advice, if this is your first purchase of a reflow oven.
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